Study on Chemical Copper Plating Technology of Multi-layer Flexible Circuit Board
多层柔性线路板化学镀铜工艺研究

摘要

化学镀铜层是金属材料经过电、热等处理后，在基体表面形成一层致密保护膜的一种特殊材质，它具有耐高温性和抗腐蚀性以及良好的机械性能。由于化学镀铜层具有良好的耐蚀性能、较高比强度以及硬度等优异特性，因此，作为非金属材料，电化学中最常见也是最有应用前景和发展空间最大的是多层柔性复合板，随着柔性电路板技术的不断更新和市场需求的增大，对化学镀铜层的工艺也提出了更高的要求，基于此，本文重点分析化学镀铜机理以及其试验方法，最后根据镀铜之间的相互影响确定最佳镀铜工艺。

Abstract

Chemical copper plating layer is a special material on the surface of the metal material, which has high temperature resistance and corrosion resistance and good mechanical properties. Because chemical copper coating has good corrosion resistance, high specific strength and hardness, therefore, as a non-metal material, the most common and the most promising and largest electrochemical multilayer flexible composite plate, with the continuous update of flexible circuit board technology and market demand, chemical copper coating process also put forward higher requirements, based on this paper focuses on the analysis of chemical copper plating mechanism and its test method, and finally determine the best copper plating process according to the influence between copper plating.